Custom thermal manufacturing since 2014
Copper Heat Sink Manufacturer for High-Power Electronics
HeatsinkMaker designs and manufactures custom copper heat sinks and thermal assemblies for demanding, high-power electronics. We support engineering-driven OEMs from early thermal design and prototyping through validation, pilot builds and mass production.
Our engineers translate thermal requirements, 2D/3D drawings and application constraints into reliable, manufacturable copper cooling solutions that meet your performance, cost and lead-time targets.
50
CNC machining centers
8
Assembly lines
±0.002 mm
Precision capability
Material expertise
Cu1100 / C1100 copper
Lifecycle support
Prototype to mass production
Engineering focus
Thermal, DFM and validation support
Thermal performance
Why choose a copper heat sink?
Copper is a strong choice when high conductivity, heat spreading and stable performance matter more than the lowest material weight.
Discuss your thermal requirementsHigh conductivity
Supports tight delta-T budgets and concentrated heat sources.
Excellent spreading
Spreads heat efficiently from small heat source footprints.
Stable under load
Performs consistently under high heat flux, transient loads and limited airflow.
Interface-ready
Suitable for baseplates, sealed modules, vapor or heat pipe interfaces and high-power density designs.
When to prefer copper over aluminum
- 01The heat source is small and highly concentrated.
- 02Thermal resistance targets cannot be met with aluminum alone.
- 03Space or airflow is limited and higher conductivity is required.
- 04You need soldered or brazed interfaces or integrated heat pipes.
Manufacturing capabilities
One supply chain for custom copper cooling
We combine thermal manufacturing processes to match your performance, geometry, volume and cost goals.
Skived copper heat sinks
Cu1100Integrated fins are skived directly from the base for minimal thermal interface resistance, high fin density and high surface area in limited footprints.
- Base thickness
- 1–40 mm
- Fin height
- Up to 60 mm
- Minimum fin thickness
- 0.05 mm
- Minimum fin gap
- 0.05 mm
- Maximum fin width
- Up to 300 mm
- Product length
- Up to 2,000 mm
Typical uses: high-power baseplates, inverter modules, power supplies, telecom and computing hardware.
Cold forged copper heat sinks
Up to 35:1Integrated pin-fin or mixed geometry, including round, oval and straight fins, can be produced without fin draft angles for suitable designs.
- • C1100 copper construction
- • Maximum fin aspect ratio up to 35:1
- • Secondary CNC machining, drilling, tapping and finishing
Typical uses: LED lighting, motor controllers, inverters and applications requiring omnidirectional airflow and low pressure drop.
CNC-machined and brazed or soldered assemblies
Precision CNC machining of copper bases and features, with stamped, zipper or folded copper fin packs soldered or brazed to copper bases.
- • CNC machine capability of ±0.002–±0.008 mm
- • Nickel plating for corrosion and oxidation resistance
- • Cleaning and inspection for consistent thermal interfaces
Heat pipe-integrated copper heat sinks
Copper heat pipes spread and transport heat to larger fin fields. Typical heat pipe diameters include Ø8 mm, with quantity and routing customized to the design.
- • Soldering or brazing for robust assemblies
- • Nickel plating options
- • Thermal testing support for module-level validation
Hybrid copper–aluminum thermal modules
A copper base provides superior spreading while high-surface-area fin stacks in copper or aluminum optimize thermal performance, weight and cost for volume production. Joining is selected according to the design using soldering or brazing.
Engineering before manufacturing
Design the cooling solution around the real application
A high-performance copper heat sink must balance heat load, source size, airflow, fin geometry, pressure drop, mounting, environment and cost.
Send an existing drawing for build-to-print, or provide heat load, maximum component temperature, ambient, airflow and available space for engineering evaluation.
Engineering support includes
- • Thermal solution development
- • Heat sink structure design
- • DFM and manufacturability review
- • Material and process selection
- • Thermal simulation support
- • Prototype development
- • Product optimization
- • Thermal resistance testing
- • Dimensional and CMM inspection
- • AutoCAD, SolidWorks and Creo workflows
Technical reference
Typical design guidelines and ranges
Final feasible geometry depends on the complete stack of thermal targets, airflow and pressure drop, structural limits and production volume.
| Category | Guideline or capability | Application note |
|---|---|---|
| Materials | Cu1100 copper; aluminum 1060/6061/6063 for hybrid assemblies | Material selection follows thermal, weight and cost targets |
| Skived copper fins | Base 1–40 mm; fin height up to 60 mm; fin thickness 0.05–2.0 mm; gap 0.05–10 mm; width up to 300 mm | Typical production fin thickness is 0.2–3.0 mm depending on application |
| Cold forged copper | Fin aspect ratio up to 35:1 | Pin, oval or straight fins selected for airflow targets |
| Machining and assembly | CNC ±0.002–±0.008 mm; soldering and brazing; nickel plating | Suitable for fin-to-base and heat pipe integration |
Quality assurance
Testing, quality and finishing
- • Thermal resistance and performance testing
- • Dimensional and CMM inspection
- • Surface and cleanliness inspection
- • Leakage and pressure testing for liquid-cooled copper modules, as applicable
- • Nickel plating and precision cleaning for copper surfaces
Production capability
Equipment and monthly capacity
200,000 pcs/month: aluminum heat sinks
150,000 pcs/month: soldered aluminum/copper heat sinks
30,000 pcs/month: liquid cold plates
50,000 pcs/month: skived fin heat sinks
300,000 pcs/month: precision machined parts
Industry experience
Built for demanding electronics programs
Program execution
From prototype to mass production
Prototype
Develop the thermal concept and confirm manufacturability.
Validation
Test thermal performance, dimensions and interfaces.
Pilot run
Optimize repeatability, quality controls and production flow.
Mass production
Deliver a manufacturable and repeatable cooling solution for your program.
We support OEM, ODM and build-to-print engagements.
Start an engineering review
Send your copper heat sink requirements
Our engineering team will recommend the most suitable copper heat sink or copper-based thermal module for your application.
What to include in your RFQ
- • 2D drawings and/or 3D CAD in STEP, IGES or SolidWorks format
- • Heat load in watts and heat source footprint
- • Maximum allowable component temperature
- • Ambient temperature and airflow or pressure drop constraints
- • Available installation space and interfaces or mounting
- • Surface finish or coating requirements, including nickel plating
- • Target annual volume and project timeline
Request a quote
Share your drawings or thermal targets with our team.
Technical questions
Copper heat sink FAQs
When is copper the best choice?
Choose copper when you need higher conductivity for tight thermal budgets, small hot spots or limited airflow that aluminum cannot satisfy.
Can you integrate heat pipes into copper heat sinks?
Yes. We design and manufacture copper heat sink assemblies with integrated copper heat pipes, soldered or brazed and validated through thermal testing.
How do you protect copper from oxidation?
Nickel plating is available for corrosion resistance and consistent surface condition. Precision cleaning is performed before assembly.
Do you support low-volume prototypes?
Yes. We support the full lifecycle from engineering prototypes to pilot and mass production, with DFM review at each stage.
HeatsinkMaker — Custom Copper Thermal Solutions. Built for Production.
Talk to an Engineer