Menu
Custom thermal solutions for power electronics

Custom IGBT Heat Sink Solutions Built for Production

Custom IGBT heat sinks and liquid-cooled assemblies engineered to move cleanly from prototype to volume production. Convert thermal targets and CAD into a reliable, manufacturable cooling solution with coordinated thermal engineering, DFM review, and production planning.

200,000

Aluminum heat sinks per month

10+ bar

Liquid plate operation, structure dependent

±0.002–0.008 mm

CNC machine capability

Custom IGBT heat sink and liquid cooling assembly

Engineering-led manufacturing

One coordinated supply chain for skiving, extrusion, cold forging, heat pipes, brazing, soldering, FSW, CNC, and testing.

Built around your application

What you get with an IGBT cooling partner

The cooling structure is matched to your load, airflow, footprint, mounting conditions, and cost target, while the manufacturing route is planned for repeatable production.

01

Thermal performance

Designs are matched to heat load, airflow, and footprint to meet junction temperature limits without unnecessary material or fan cost.

02

Controlled pressure drop

Fin geometries and base structures are selected around pressure drop, mechanical constraints, fan power, and system noise.

03

Production-ready prototypes

Prototype parts use the intended production process wherever possible, reducing re-qualification risk between design validation and volume manufacturing.

04

Early DFM review

Mounting holes, flatness strategy, machining allowances, plating impacts, and assembly requirements are reviewed before production tooling or release.

05

Integrated processes

Skiving, extrusion, cold forging, heat pipes, brazing, soldering, FSW, and CNC are coordinated through a single supply chain.

06

Measured validation

Validation can include thermal resistance, airflow and pressure, leak and pressure testing for liquid plates, and dimensional or CMM inspection.

Cooling architecture

Select the right IGBT heat sink or cold plate

The recommended route depends on heat flux, airflow mode, module footprint, enclosure, pressure drop, and target cost.

Discuss your thermal target

Skived fin heat sinks

Aluminum or copper fins formed from the base for high density, large surface area, and low thermal interface resistance in forced-air cabinets.

Extruded aluminum heat sinks

Cost-effective for repeat production with moderate-to-high aspect ratios, plus in-house CNC machining, drilling, tapping, anodizing, and FSW assembly.

Cold forged pin-fin heat sinks

Aluminum or copper integrated pin-to-base structures with no fin draft angle, supporting multi-directional airflow in compact cabinets and fan trays.

Heat pipe-assisted assemblies

Copper heat pipes spread concentrated module heat into stamped or zipper fin arrays and machined bases. Soldering, brazing, nickel plating, and validation are available.

Liquid-cooled IGBT cold plates

Vacuum brazed, FSW, or embedded-tube plates with custom flow channels and microchannels to balance pressure drop and thermal resistance. Aluminum structures can be designed for operation above 10 bar depending on construction, with pressure and leakage testing.

Engineering support

Thermal and mechanical decisions before manufacturing

A reliable IGBT heat sink balances heat source size, airflow, fin geometry, pressure drop, mounting method, environment, and cost. Engineering support is available from an early application brief through production release.

  • Evaluate the thermal target and allowable temperature rise.
  • Select base material and fin geometry for heat spreading and convection.
  • Plan mounting and flatness strategies for reliable IGBT contact pressure.
  • Review machining, plating, assembly, and DFM requirements.
  • Prototype with the intended production process and validate performance.

Start with your available data

AutoCAD, SolidWorks, and Creo files are accepted. The review can begin with a finished drawing or basic application data.

Finished design

Send 2D drawings and 3D CAD for manufacturability and quotation review.

Early platform concept

Share heat load, airflow or coolant data, envelope limits, and target temperature rise.

Custom module layout

Design around exact hole patterns, creepage distances, isolation needs, and contact areas.

Prototype to production

Compress the design loop without changing the process later

Production-intent prototypes help validate thermal and mechanical performance before pilot build, reducing redesign risk and supporting PPAP or equivalent approvals.

01 · Prototype

Test real geometries

Skived and extruded prototypes accelerate airflow and pressure testing on the intended fin structures.

02 · Validate

De-risk sealing and fit

Early leakage and pressure tests on liquid plates help confirm sealing strategies and mechanical interfaces.

03 · Pilot

Synchronize the build

In-house CNC and finishing reduce handoffs while prototype, validation, and pilot runs are staged around system testing.

Application coverage

Cooling for demanding power systems

Support is available for standard IGBT module footprints as well as custom baseplates and dual-module layouts.

Power electronics, drives, and motor controllers
Solar and energy storage inverters
EV traction and DC/DC converters
UPS and high-reliability power systems
Industrial automation and control cabinets
Telecom, computing, and data center power modules
Laser and medical power supplies

Technical reference

Capability and parameter guide

Use these ranges to map your requirements to a manufacturing route. Final capability is confirmed against the drawing and thermal targets.

Review my requirements
Parameter Capability / range Notes
MaterialsAL1060, AL6061, AL6063; Cu1100Select for cost, weight, and thermal conductivity
ProcessesSkiving, extrusion, cold forging, CNC, FSW, soldering, brazing, bonded finChosen to match fin density, size, and volume
Base thickness1–40 mmSkived and machined bases; thicker bases for heat spreading
Skived fin heightUp to 150 mm aluminum; 60 mm copperHigh surface area for forced-air designs
Skived fin thickness0.2–3.0 mm typical; down to 0.05 mm availableSet by airflow and fouling risk
Skived fin gap0.2–10 mmSet for target pressure drop
Extruded aspect ratioTypically >20:1; FSW assemblies >40:1FSW enables ultra-wide profiles
FSW assembly widthUp to approximately 762 mmDesign dependent
LengthSkived product up to 2,000 mm; processing up to 3,500 mmConsult for long or heavy parts
Cold forged pin-fin aspect ratioUp to 35:1Round, oval, and straight pins available
Heat pipesTypical Ø8 mm; quantity and layout customizableFor heat spreading under fin arrays
Surface finishesAnodizing, hard anodizing, nickel plating, passivation, sandblasting, polishingConsider emissivity, corrosion, and contact resistance
MountingDrilled/tapped holes, slots, isolation standoffsDesigned for module and creepage requirements
TestingThermal resistance, airflow/pressure, leak/pressure, dimensional/CMMTest plan aligned to validation requirements

Quality assurance

Testing you can rely on

  • Thermal resistance testing: Verify design targets under specified airflow or coolant conditions.
  • Leakage and pressure testing: Confirm liquid plate integrity and sealing performance.
  • CMM and 2D measurement: Inspect critical dimensions, interfaces, and flatness.
  • Cleanliness and surface inspection: Align inspection with drawing and process requirements.

Production footprint

Capacity for prototypes and volume

50 sets

CNC machining centers

5 sets

Skiving machines

2 sets

FSW machines

300,000

Precision machined parts/month

Liquid plate production includes vacuum brazing and embedded-tube options. Assembly lines support thermal modules.

RFQ preparation

Send the information needed for an accurate quote

Include the details below to receive a manufacturable concept, lead time, pricing, and a build plan aligned to your schedule.

Send your RFQ package
012D drawing and 3D CAD in STEP or IGES format
02Heat load per device and total load
03Maximum allowable junction or case temperature
04Module footprint, mounting pattern, and contact area
05Airflow data or coolant flow, inlet temperature, and pressure limits
06Target thermal resistance or temperature rise
07Envelope constraints and weight limits
08Surface finish, coating, isolation, and TIM requirements
09Annual volume and prototype-to-mass-production ramp plan
10Compliance or test standards to be met

Build with confidence

Let’s build your IGBT heat sink

Whether you need a skived aluminum heat sink, a copper-spread heat pipe module, or a vacuum-brazed cold plate, get a cooling solution that is manufacturable, repeatable, and ready for production.

Send your CAD and thermal requirements for an application review, manufacturing route recommendation, quotation, and build plan aligned to your schedule.

Request an engineering review

Share your drawing, heat load, airflow or coolant conditions, and target build dates.