Custom Stamped Heat Sink & Folded Fin Solutions for High-Power Electronics
HeatsinkMaker specializes in the design and volume manufacturing of custom stamped heat sinks and high-density folded fin assemblies. We help OEMs and engineering teams transform complex thermal requirements into reliable, production-ready cooling solutions.
If you are looking for a manufacturing partner to handle everything from thermal simulation and DFM review to mass production, we provide the technical expertise and vertical integration your project requires.
Why Choose Stamped and Folded Fin Heat Sinks?
For applications requiring high surface area in a lightweight package, stamped heat sinks—specifically folded fins and zipper fins—offer significant advantages over traditional extrusions:
Increased Surface Area
Achieve much higher fin density and thinner fins (down to 0.2mm) than extrusion allows.
Weight Reduction
Ideal for weight-sensitive applications in aerospace, telecommunications, and portable electronics.
Material Hybridization
Combine copper fins with aluminum bases to optimize the balance between thermal performance, weight, and cost.
Complex Geometries
Stamping allows for specialized fin shapes, louvers, and offsets to optimize airflow and turbulence.
Our Stamping & Assembly Capabilities
At HeatsinkMaker, we don't just stamp metal; we engineer thermal modules. Our facility is equipped to handle the entire lifecycle of a stamped heat sink assembly.
| Capability | Specification |
|---|---|
| Stamping Tonnage | 30T – 200T (10 sets of stamping machines) |
| Fin Materials | Aluminum 1060, 6061; Copper C1100 |
| Fin Thickness | 0.2 mm – 2.0 mm |
| Assembly Processes | Soldering, Brazing, Epoxy Bonding, Mechanical Press-fit |
| Secondary Machining | CNC Milling, Drilling, Tapping, Surface Grinding |
| Surface Finishing | Anodizing, Nickel Plating, Passivation, Chromate Conversion |
Zipper Fin & Folded Fin Assemblies
We specialize in Zipper Fin stacks, where individual fins are stamped with interlocking features. This creates a structurally stable fin pack that can be easily soldered or brazed to a CNC-machined base or integrated with heat pipes.
Heat Pipe Integration
To manage high heat flux, we often integrate stamped fin stacks with copper heat pipes. Our engineering team ensures the interface between the heat pipe and the stamped fin is optimized for minimal thermal resistance.
Engineering Before Manufacturing
A high-performance stamped heat sink requires more than just a press and a die. Our engineers work with your team to ensure the design is optimized for both thermal efficiency and manufacturability (DFM).
Thermal Simulation
We use SolidWorks and Creo to evaluate airflow, pressure drop, and thermal resistance before tooling begins.
Material Selection
We help you choose the right alloy (AL1060 vs. AL6063 or C1100) based on your thermal load and budget.
Prototype to Production
We provide rapid prototypes for thermal validation before moving into hard tooling for high-volume runs.
Industries We Serve
Our stamped heat sink solutions are utilized by industry leaders across multiple sectors:
Telecommunications & 5G
High-density cooling for RRUs and base stations.
Data Centers & Servers
Lightweight, high-airflow fin stacks for CPU/GPU cooling.
Power Electronics
Inverters, UPS, and motor drives.
Renewable Energy
Solar inverters and energy storage systems (ESS).
Medical & Laser Equipment
Precision cooling for sensitive optical and electronic components.
Your Partner from Prototype to Mass Production
Whether you have a completed 3D CAD model or just a set of thermal requirements, HeatsinkMaker is ready to support your project. We understand the pressure of launch timelines and the necessity of consistent quality in B2B supply chains.
Ready to start your project? Provide us with:
- 1 Your 2D/3D drawings (Step, DWG, or DXF).
- 2 Thermal requirements (Heat load, max temperature, airflow).
- 3 Estimated annual volume.
Contact HeatsinkMaker Today for a Custom Quote
Our engineering team typically responds within 24 hours with a technical evaluation and quotation.