Thermal Solutions for OEMs
Custom Chip Heat Sinks Built for Production
We design and manufacture custom chip heat sinks that meet exact thermal, mechanical, and production requirements for engineering-driven OEMs. From initial thermal evaluation to volume manufacturing, we deliver reliable cooling solutions that integrate directly into your power electronics, inverters, motor drives, and computing hardware.
Engineering Partnership from Data to Production
Send us your 2D drawing, 3D CAD file, or basic application data including heat load, maximum component temperature, ambient conditions, and annual volume. Our team provides DFM review, material and process selection, thermal simulation support, and prototype development before moving to validation and mass production.
Data Review
Heat load, component temperature, airflow, and space constraints.
DFM & Process
Material and manufacturing route selection for performance and cost.
Simulation
Thermal modeling to validate design choices before tooling.
Prototype
First articles for fit, performance, and design confirmation.
Validation & Volume
Testing, pilot run, and mass production under one supply chain.
Manufacturing Range for Chip Heat Sinks
Our chip heat sink capabilities cover aluminum and copper constructions using skiving, extrusion, cold forging, heat pipe integration, and liquid cold plates. Each solution is developed with your heat load, airflow, space constraints, and target cost in mind.
Skived Fin Heat Sinks
High-density fins with excellent thermal conductivity for compact packages.
Fin thickness down to 0.05 mmExtruded Profiles
Cost-effective aluminum extrusions for medium to high-volume programs.
Widths up to 762 mmCold Forged Pin-Fin
High-density pin-fin designs with omni-directional airflow performance.
Copper and aluminum optionsHeat Pipe Assemblies
Rapid heat spreading from concentrated chip heat sources to remote fins.
Custom bending and mountingLiquid Cold Plates
Vacuum-brazed and embedded-tube designs for high-power chips.
Leak-tested before shipmentSecondary Finishing
CNC machining, surface treatment, anodizing, and nickel plating.
Dimensional & thermal testingTechnical Parameters
| Process | Materials | Key Capability | Typical Application |
|---|---|---|---|
| Skived fin | Aluminum, copper | Fin thickness down to 0.05 mm, high aspect ratios | Power semiconductors, computing chips |
| Extrusion + FSW | Aluminum alloys | Profiles up to 762 mm wide | Inverters, motor drives |
| Cold forging | Aluminum, copper | High-density pin-fin arrays | IGBT modules, industrial controllers |
| Heat pipe assembly | Copper heat pipes, aluminum fins | Concentrated heat spreading | Telecom, servers, EV powertrains |
| Liquid cold plate | Aluminum, copper, stainless steel | Vacuum-brazed and embedded-tube designs | High-power chips, energy storage |
Ideal Projects
We work with power electronics manufacturers, solar and energy storage companies, EV suppliers, industrial automation, telecom, and computing hardware OEMs that need repeatable chip heat sink production.
Power Electronics
IGBTs, MOSFETs, and rectifiers in converters and inverters.
Solar & Energy Storage
Battery management systems, charge controllers, and power conditioning.
Electric Vehicles
OBCs, DC-DC converters, motor controllers, and power modules.
Industrial Automation
Servo drives, PLCs, and variable frequency drives.
Telecom & Networking
Base stations, routers, and high-density signal processing hardware.
Computing Hardware
GPUs, CPUs, and AI accelerator modules requiring precise cooling.
Volume-Ready Manufacturing
Typical programs move from prototype through pilot run to monthly volumes of 50,000+ units, with consistent quality and traceability.
Request a Chip Heat Sink Quote
Submit your drawing or thermal requirements today. Our engineering team will evaluate the application and recommend the most suitable chip heat sink manufacturing route within days.
Send Your Requirements
Upload 2D drawings, 3D CAD files, or share application data and we will respond with a DFM review and manufacturing recommendation.